∙ High laser homogeneity with VcSEL
∙ Available for both LAB( Laser Assisted Bond) and LAS
( Laser Assisted Soldering )
∙ Extremely short process time of LAB & LAS
∙ High concrete bondability with stable IMC
( Intermetallic Compound) growth
∙ Small package warpage
∙ Shiny surface of melted solderball
∙ Accessible for micro solder ball
∙ Small COO Small footprint/Low electricity /No use of N2 gas
∙ Proprietary IP for stable temperature management
( Patent hold)